BOKAR soldering equipment

Replacement air nozzle (17.5x17.5 mm) for soldering BQFP ICs. Compatible with BOKAR Focus "X".

 

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The system has several unique features, which make the rework operations safer, faster and more precise, saving user's time and efforts.

 

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Preheat area: 52 cm²;Preheat temperature: 60-150 °C; Average PCB preheat time to 150 °C: < 2 min.

 

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A Unique, Modular, Digital PID Control SMT Rework/Repair System with integrated Pre-heater, which offers precise and accurate monitoring of process temperatures at a working point on a PCB.

 

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Bokar A-S3-L ESD High Performance Gloves

Static dissipate new continuous filament conductive fiber. Suitable for clean room application.

Resistivity: 10e7 Ohms/sq

Size: L

 

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Bokar A-S3-M ESD High Performance Gloves

Static dissipate new continuous filament conductive fiber. Suitable for clean room application.

Resistivity: 10e7 Ohms/sq

Size: M

 

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Bokar XURB-S set has an independent heating system, a Hot Plate XURB-H matching the reballing fixture. This heating method allows for reflow of reballed IC in approximately 2 minutes, which is 2 to 3 times faster and better than on any other heating system.

 

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BOKAR XU-1S Universal, Retractable Board Holder for boards up to 12" wide.

 

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